Company
About Us
Who We Are
VoltarisTech Inc. is a semiconductor company based in Southern California. We collaborate closely with our partner company in the development, manufacturing, and distribution of high-performance diode products for a wide range of applications, including computing, telecommunications, automotive, industrial, and renewable energy sectors.
Founded in 1965 in China, our partner company is a well-established discrete semiconductor solution provider. Since the 1990s, through a series of intellectual property acquisitions from Fortune 500 companies in Europe and North America, our partner has significantly expanded its technology portfolio and manufacturing capabilities.
Today, our product line spans a full spectrum of diode categories—from rectifying, switching, to Zener diodes; from chip-level solutions to bridge modules; from glass-passivated to epoxy resin packages; from standard, off the shelf to products designed to meet specific customer requirements.
With an annual production volume exceeding 200 million diodes, and continuing to grow, we are committed to delivering reliable, high-quality semiconductor solutions to customers worldwide.
What We Do
Manufacturing
From raw silicon wafer to finished device, two VoltarisTech Inc. featured product lines are showcased through end-to-end production flows, with photography capturing critical stages.
GPP (Glass Passivated Pellet) Chip Process
01·Wafer Preparation
02·Junction Formation
03·Sandblasting/Wet Etching
04·Lifetime Kill
07·2nd Photo and Glass Firing
06·SIPOS Deposition
05·1st Photo and Moat Etching
08·3rd Photo and LTO Patterning
09·Nickel/Gold Plating
10·Wafer Dicing
STEP 01 / 10Wafer Preparation
Raw silicon wafers are selected based on specified resistivity and thickness requirements, then subjected to thorough cleaning to remove surface contaminants and foreign materials.
Sintered Glass Diode Process
01·Wafer Preparation
02·Junction Formation
03·Sandblasting/Wet Etching
04·Lifetime Kill
07·Brazing
06·Wafer Dicing
05·Metal Evaporation
08·Passivation
09·Glass Firing
10·Lead Plating
STEP 01 / 10Wafer Preparation
Raw silicon wafers are selected based on specified resistivity and thickness requirements, then subjected to thorough cleaning to remove surface contaminants and foreign materials.
Testing
From commercial- to space-grade applications, our comprehensive in-house testing is fully compliant with MIL-STD-750/MIL-PRF-19500 qualification standards or equivalent.
3 Domains · 24 Tests
Equipment Reference
Temperature Cycling / Thermal Shock
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